Huatian Technology invests in Lingsi Microelectronics to improve the short-range wireless communication industry

On June 22, Huatian Technology (002185.SZ) participated in the A round of financing of Lingsi Microelectronics (Xiamen) Co., Ltd. (hereinafter referred to as "Lingsi Microelectronics"). This time the investors also include Kaifeng Venture Capital and Changjiang Capital, etc. Investment agency. This round of financing of Lingsi Microelectronics will be used for the company's capacity expansion, technology research and development, and channel development, to support the R&D investment and technology iteration of new products.

Huatian Technology's investment is for the recognition of Lingsi Microelectronics chip products and technical level in the field of short-distance wireless communication and will provide technical support for Lingsi Microelectronics in chip packaging and mass production. Lingsi Microelectronics can take advantage of Huatian Technology's strong packaging and testing capabilities, and Huatian Technology can also use this to improve its industrial layout in the field of short-range wireless communications. The two parties will have a better synergy effect.

The Tianyan Check App shows that Lingsi Microelectronics is an enterprise focusing on the design and development of industrial control and consumer electronics chips. With chips as the core, it also provides industry customers with reference designs and module solutions for related intelligent hardware.

The core team members of Lingsi Microelectronics have extensive experience in radio frequency, communication algorithms, SOC design, and software solutions. At present, they have achieved mass production of the first Bluetooth BLE 5.0/5.1 chip product, and the key performance has reached the first-class level and has passed BLE5. xBQB certification, including a full set of certifications for radio frequency, Linklayer, and MESH.

The LE501X/LE511X series of Bluetooth BLE5.0/5.1SOC products have the worlds leading technical performance indicators. LE5010/5110 supports BLE5.0 and 5.1 full protocol SOC chips, which can be widely used in positioning, networking, and data BLE application areas such as transmission. Its comprehensive index performance is in the leading position in China, the key index radiofrequency has reached the international high level, the sensitivity can reach 100dBm/1Mbps, the transmission power 13dBm, the link gain 113dBm/1Mbps, the theoretical communication distance can reach 300 meters, and the measured effective communication distance exceeds 200m. (Send 0dBm, 1Mbps rate).

At present, Lingsi Microelectronics products have obtained Ali Central Procurement Certification, State Grid IR46 meter standard finalization, and obtained batch orders from many benchmark customers such as Ali, Huawei, and State Grid. In addition, based on the company's understanding of the consumer electronics market, Ling Siwei has actively defined a variety of products including Bluetooth 5.2, UWB, WIFI6, and will continue to make efforts in the consumer electronics and industrial manufacturing fields.

Huatian Technology is mainly engaged in the packaging and testing business of semiconductor integrated circuits, MEMS sensors, semiconductor components, and other integrated circuits. It is an internationally renowned semiconductor packaging and testing manufacturer. According to TrendForce data, in the first half of 2020, Huatian Technology achieved 6.4% The market share ranks sixth in the global packaging and testing market, and only Changjiang Electronics Technology (600584.SH) has a higher market share than Huatian in China.

Huatian Technology has formed a development pattern in Tianshui, Xi'an, Kunshan, Nanjing, and other places, and the production lines of each base have different focuses. Tianshui base is mainly based on lead frame products, and the products mainly involve drive circuits, power management, Bluetooth, MCU, NORFlash, electric meter circuit, etc.; Xi'an base is mainly based on substrates and QFN, DFN products, and the products mainly involve radiofrequency, MEMS, memory, fingerprint products, TWS, automotive electronics, MCU, power management, etc.; Kunshan is a packaging crystal Round-level products mainly include TSV, Bumping, WLCSP, Fan-Out, etc. The first phase of the Nanjing base was officially put into production in July 2020, planning the packaging and testing of integrated circuit products such as memory and MEMS, covering the full range of lead frame, substrate, and wafer-level products.

With the improvement of the portability of equipment, the demand for short-range wireless communication products has gradually increased. As the leader of the packaging industry, Huatian Technology has begun to enter related industries. Compared with the previous generation of Bluetooth technology, Lingsi Microelectronics Bluetooth BLE5.0/5.1 chip series products have greater advantages in transmission speed and transmission information and have the characteristics of small size and low energy consumption. They are currently relatively advanced The new Bluetooth communication technology, and has achieved mass production, can help Huatian Technology take the lead in establishing advantages in the field of short-range wireless communication products.

This is not the first time that Huatian Technology has invested in a short-range wireless communication company. In December 2020, Huatian Technology participated in the strategic financing of Yizhao Microelectronics, a well-known domestic Bluetooth and WIFI chip manufacturer. The company is mainly engaged in Bluetooth and WIFI. Design, development, and sales of applied wireless system-on-chips and radio frequency chips.